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| 化学改性制备豆粕基木材胶黏剂 |
| Preparation of soybean meal based wood adhesive by chemical modification |
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| DOI： |
| 中文关键词: 豆粕 化学改性 木材胶黏剂 改性机理 |
| 英文关键词:soybean meal chemical modification wood adhesive modification mechanism |
| 基金项目:河南省谷物资源转化与利用重点实验室开放课题(PL2017007)；河南工业大学青年骨干教师培育计划；河南省重大科技专项（181100310200） |
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| 中文摘要: |
| 采用化学改性剂聚乙二醇（PEG）、聚乙烯亚胺（PEI）、马来酸酐（MAH）、环氧树脂（EP）和尿素对豆粕进行改性，制备豆粕基木材胶黏剂。研究单一改性剂和复合改性剂对胶黏剂胶合强度的影响，以胶黏剂黏度值、胶合强度和固形物含量为指标，通过单因素实验和正交实验优化得到最佳改性条件。同时，采用傅里叶红外光谱（FT-IR）、扫描电子显微镜（SEM）和X-射线衍射（XRD）分析了改性机理。结果表明：化学改性制备豆粕基木材胶黏剂的最佳工艺条件为PEG与PEI质量比7∶ 8、反应时间70 min、反应温度15 ℃、豆粕质量分数25%，此条件下制得的胶合板干、湿胶合强度分别为1.93 MPa和0.86 MPa，符合国标对Ⅱ类胶合板胶合强度（湿胶合强度≥0.70 MPa）的要求。化学改性剂可以破坏大豆蛋白分子结构，暴露出分子内部的极性与非极性基团，从而通过氢键、静电相互作用等与化学改性剂交联，增加了胶黏剂的黏结特性和耐水性。 |
| 英文摘要: |
| Chemical modifiers including polyethylene glycol (PEG), polyethyleneimine (PEI), maleic anhydride (MAH), epoxy resin (EP) and urea were used to modify the soybean meal to prepare soybean meal based wood adhesive. The influence of single and composite modifier on the bonding strength of the adhesive was analyzed. With viscosity, bonding strength and solid content of the adhesive as indexes, the modification conditions were optimized by single factor experiment and orthogonal experiment. At the same time, Fourier infrared spectroscopy (FT-IR), scanning electron microscope (SEM), and X-ray diffraction (XRD) were used to analyze the modification mechanism. The results indicated that the optimal modification conditions were obtained as follows: mass ratio of PEG to PEI 7∶ 8, reaction time 70 min, reaction temperature 15 ℃ and soybean meal mass fraction 25%. Under these conditions, the dry and wet bonding strength reached 1.93 MPa and 0.86 MPa respectively, which met the national standard for type II plywood (wet bonding strength≥0.70 MPa). The molecular structure of soybean protein could be destroyed by chemical modifier, exposing the polar and non-polar groups inside the molecule, and it was cross-linked with chemical modifier through hydrogen bond and electrostatic interaction, which increased the bonding properties and water resistance of the adhesive. |
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