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| Preparation of soybean meal based wood adhesive by chemical modification |
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| DOI： |
| KeyWord:soybean meal chemical modification wood adhesive modification mechanism |
| FundProject:河南省谷物资源转化与利用重点实验室开放课题(PL2017007)；河南工业大学青年骨干教师培育计划；河南省重大科技专项（181100310200） |
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| Abstract: |
| Chemical modifiers including polyethylene glycol (PEG), polyethyleneimine (PEI), maleic anhydride (MAH), epoxy resin (EP) and urea were used to modify the soybean meal to prepare soybean meal based wood adhesive. The influence of single and composite modifier on the bonding strength of the adhesive was analyzed. With viscosity, bonding strength and solid content of the adhesive as indexes, the modification conditions were optimized by single factor experiment and orthogonal experiment. At the same time, Fourier infrared spectroscopy (FT-IR), scanning electron microscope (SEM), and X-ray diffraction (XRD) were used to analyze the modification mechanism. The results indicated that the optimal modification conditions were obtained as follows: mass ratio of PEG to PEI 7∶ 8, reaction time 70 min, reaction temperature 15 ℃ and soybean meal mass fraction 25%. Under these conditions, the dry and wet bonding strength reached 1.93 MPa and 0.86 MPa respectively, which met the national standard for type II plywood (wet bonding strength≥0.70 MPa). The molecular structure of soybean protein could be destroyed by chemical modifier, exposing the polar and non-polar groups inside the molecule, and it was cross-linked with chemical modifier through hydrogen bond and electrostatic interaction, which increased the bonding properties and water resistance of the adhesive. |
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