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| 粮食温控直剪仪改造及其在大豆力学特性
研究性试验中的应用 |
| A modified temperature-controlled grain direct shearing apparatus and its application in soybean mechanical properties research test |
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| DOI：10.19902/j.cnki.zgyz.1003-7969.230377 |
| 中文关键词: 温控直剪仪 大豆籽粒群 力学特性 温度影响 |
| 英文关键词:temperature-controlled direct shearing apparatus soybean grain group mechanical property temperature effect |
| 基金项目:河南省高等教育教学改革研究与实践重点项目（2021SJGLX144）；河南工业大学教育教学改革研究与实践重点项目（JXYJ2021006）；河南省科技研发计划联合基金项目（222103810075）；河南工业大学创新基金支持计划专项资助（2022ZKCJ07） |
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| 中文摘要: |
| 为获得温度影响下的粮食力学参数，为粮仓相关设计提供参考，对现有粮食静动直剪仪进行改进，增设了保温剪切盒及智能温控系统，并利用该设备在大豆含水率8.99%~15.12%、孔隙率36%、温度25~45 ℃、竖向应力50~200 kPa、剪切速率2.4 mm/min、剪切位移幅值20 mm条件下开展了一系列大豆籽粒群的温控单调剪切试验，测定不同温度条件下大豆籽粒群的抗剪强度及体积剪切变形参数。结果表明：大豆籽粒群内摩擦角范围为37.1°~44.6°，咬合应力范围为9.6~21.2 kPa；温度升高会显著降低大豆籽粒群的剪胀性，亦会改变大豆籽粒群的强度特性。改进后的粮食温控直剪仪温度控制稳定，试验结果满足测试需求，可为研究性试验开展、科技创新和工程应用等提供有力的支撑。 |
| 英文摘要: |
| To obtain the mechanical parameter of grain under the temperature influence and provide reference for the related design of silos, the thermal insulation shear box and intelligent temperature control system were installed based on the existing grain static and dynamic direct shearing apparatus. A series of temperature-controlled direct shear tests were performed under the conditions of soybean moisture content 8.99%-15.12%, porosity 36%, temperature 25-45 ℃, vertical stress 50-200 kPa, shear rate 2.4 mm/min and shear displacement amplitude 20 mm. The parameters of shear strength and the corresponding deformation were obtained to consider the effect of temperature. The results showed that the internal friction angle ranged from 37.1° to 44.6°, and the occlusal stress ranged from 9.6 kPa to 21.2 kPa. The increase of temperature could significantly reduce the dilatancy of soybean grain group and change its strength characteristics. The temperature control of the modified temperature-controlled grain direct shearing apparatus is stable, and the test results meet the test requirements, so it can provide strong support for research experiments conducting, scientific and technological innovation and engineering applications. |
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